Figures
1 Introduction to Vacuum Technology
- Figure 1.1
- Overview of vacuum
- Figure 1.2
- Definition of total pressure
- Figure 1.3
- Definition of partial pressure
- Figure 1.4
- Mean free path between two collisions
- Figure 1.5
- Molecular number density (red, right-hand y axis) and mean free path (blue, left-hand y axis) for nitrogen at a temperature of 273.15 K
- Figure 1.6
- Profiles of the various types of flow regimes
- Figure 1.7
- Flow ranges in vacuum as a function of p · d
- Figure 1.8
- Conductance of a smooth round pipe as a function of the mean pressure in the pipe
- Figure 1.9
- Vapor pressure curves of various substances
- Figure 1.10
- Typical residual gas spectrum of a vessel evacuated by a turbomolecular pump
2 Basic calculations
- Figure 2.1
- No-load compression ratio for air with Roots pumps
- Figure 2.2
- Volume flow rate (pumping speed) of a pumping station with Hepta 100 and Okta 500
- Figure 2.3
- Drying system (schematic)
- Figure 2.4
- Roots pumping station for vapor condensation
- Figure 2.5
- Roots pumping station for vapor condensation
- Figure 2.6
- Roots pumping station for transformer drying
- Figure 2.7
- Gas throughput of different turbopumps at high process pressures
- Figure 2.8
- Vacuum system with pressure and throughput regulation
3 Mechanical components in vacuum
- Figure 3.1
- Temperature dependence of the elasticity modulus of austenitic stainless steel
- Figure 3.2
- Temperature dependence of the 0.2% yield point of austenitic stainless steel
- Figure 3.3
- De Long diagram
- Figure 3.4
- Cross section image of a laser weld
- Figure 3.5
- Cross section image of WIG orbital weld
- Figure 3.6
- O-ring seals in rectangular groove, trapezoidal-groove and in an angular position
- Figure 3.7
- ISO-KF connection with centering ring and clamping ring
- Figure 3.8
- ISO-KF flange mounted on base plate with centering ring and claw clamps
- Figure 3.9
- ISO-K connection with centering ring and double claw clamps
- Figure 3.10
- ISO-K flange mounted on base plate with centering ring and claw clamps
- Figure 3.11
- ISO-K flange mounted on base plate with O-ring nut and claw clamps for base plate with sealing groove
- Figure 3.12
- ISO-K flange mounted on base plate with O-ring nut and claw clamps for base plate with sealing groove
- Figure 3.13
- SO-F connection with centering ring and screws
- Figure 3.14
- ISO-K flange with bolt ring mounted on ISO-F flange with centering ring and screws
- Figure 3.15
- CF connection with copper flat gasket and screws
- Figure 3.16
- COF connection with copper wire seal and screws
- Figure 3.17
- EUV source chamber with cooling profiles and water-cooled flanges
- Figure 3.18
- Space simulation chamber with pillow plate cooling
- Figure 3.19
- CF viewport with glass-metal fusing
- Figure 3.20
- Electrical feedthrough with ceramically insulated wire conductor made of copper
- Figure 3.21
- Bellows-sealed angle valve
- Figure 3.22
- Inline valve with electropneumatic actuation
- Figure 3.23
- UHV gate valve
- Figure 3.24
- UHV all-metal gas dosing valve
- Figure 3.25
- Bellows-sealed UHV rotary feedthrough (cattail principle)
- Figure 3.26
- Magnetically coupled UHV rotary feedthrough
- Figure 3.27
- Elastomer-sealed rotary feedthrough
- Figure 3.28
- Z-axis precision manipulator
- Figure 3.29
- XY-axis precision manipulator
4 Vacuum generation
- Figure 4.1
- Overview of vacuum pumps
- Figure 4.2
- Operating principle of a rotary vane pump
- Figure 4.3
- Pfeiffer Vacuum rotary vane pumps
- Figure 4.4
- Accessories for rotary vane pumps
- Figure 4.5
- Operating principle of a diaphragm vacuum pump
- Figure 4.6
- Operating principle of a screw pump
- Figure 4.7
- HeptaDry rotors
- Figure 4.8
- HeptaDry with connections and accessories
- Figure 4.9
- Operating principle of an air cooled multi-stage Roots pump
- Figure 4.10
- Condensation of ammonium hexafluorosilicate (NH4)2SIF6 in a Roots pump operated at too low a temperature
- Figure 4.11
- Operating principle of a multi-stage Roots pump, process pump
- Figure 4.12
- ACP 120
- Figure 4.13
- A 100 L rear side with connections
- Figure 4.14
- A 203 H cross-section
- Figure 4.15
- A 1503 H process pumping station
- Figure 4.16
- Operating principle of a Roots pump
- Figure 4.17
- Operating principle of a gas-cooled Roots pump
- Figure 4.18
- No-load compression ratio for air for Roots pumps
- Figure 4.19
- Pumping speed of pumping stations with Okta 2000 and various backing pumps
- Figure 4.20
- Operating principle of a side channel vacuum pump
- Figure 4.21
- Degrees of freedom of a turbo-rotor
- Figure 4.22
- Operating principle of the turbomolecular pump
- Figure 4.23
- Specific turbopump pumping speeds
- Figure 4.24
- Pumping speed as a function of relative molecular mass
- Figure 4.25
- Pumping speed as a function of inlet pressure
- Figure 4.26
- Operating principle of a Holweck stage
- Figure 4.27
- Compression ratios of pure turbopumps and turbo drag pumps
- Figure 4.28
- Typical UHV residual gas spectrum (turbopump)
- Figure 4.29
- Standard HiPace turbopumps
- Figure 4.30
- ATH M magnetic-levitation turbopump
- Figure 4.31
- Example of turbopump accessories (for HiPace 300)
5 Vacuum measuring equipment
- Figure 5.1
- Design of a diaphragm vacuum gauge
- Figure 5.2
- Design of a capacitative diaphragm vacuum gauge
- Figure 5.3
- Operating principle of the Pirani vacuum gauge
- Figure 5.4
- Pirani vacuum gauge curves
- Figure 5.5
- Design of an inverted magnetron
- Figure 5.6
- Operating principle of an inverted magnetron
- Figure 5.7
- Design of a Bayard-Alpert vacuum gauge
- Figure 5.8
- Pressure measurement ranges and measurement principles
- Figure 5.9
- Application concepts DigiLine
- Figure 5.10
- ActiveLine application concepts
- Figure 5.11
- TPG 300 control unit for ModulLine sensors
6 Mass spectrometers and residual gas analysis
- Figure 6.1
- Total and partial pressure measurement
- Figure 6.2
- Components of a mass spectrometer
- Figure 6.3
- Operating principle of the 180° sector mass spectrometer
- Figure 6.4
- Sector field mass spectrometers: (a) Ion source, (b) Detector
- Figure 6.5
- Quadrupole deflection voltage
- Figure 6.6
- Stability diagram of a quadrupole filter
- Figure 6.6b
- Section through an axial ion source
- Figure 6.7
- Ionization as a function of electron energy
- Figure 6.8
- Fragment ion distribution of CO2
- Figure 6.9
- Grid ion source
- Figure 6.10
- Discrimination of EID ions
- Figure 6.11
- Crossbeam ion source
- Figure 6.12
- Gas-tight axial ion source
- Figure 6.13
- SPM ion source
- Figure 6.14
- PrismaPlus ion sources
- Figure 6.15
- Operating principle of a Faraday Cup
- Figure 6.16
- Secondary electron multiplier (SEM) SEV
- Figure 6.17
- Operating principle of continuous secondary electron multiplier (C-SEM)
- Figure 6.18
- QMS with gas inlet system and crossbeam ion source
- Figure 6.19
- Differentially pumped QMS with various gas inlets
- Figure 6.20
- Potential curve in an electrically biased ion source
- Figure 6.21
- 90° off axis SEM
7 Leak detection
- Figure 7.1
- Bubble leak test on a bicycle tube
- Figure 7.2
- Working principle of a sector mass spectrometer
- Figure 7.3
- General leak detector flow chart
- Figure 7.4
- Operating principle of quartz window sensor
- Figure 7.5
- Vacuum diagram of the MiniTest quartz window leak detector on a system
- Figure 7.6
- Local leak detection with sniffing and vacuum methods
- Figure 7.7
- Integral leak detection with the vacuum method
- Figure 7.8
- Integral leak detection of enclosed objects with the sniffer method
- Figure 7.9
- Mass spectrum of a recipient with air leak
- Figure 7.10
- Leak testing unit for refrigerant hoses
- Figure 7.11
- Helium recovery unit
8 Contamination management solutions
- Figure 8.1
- Moore’s Law (documented by the number of transistors in Intel and AMD microprocessors)
- Figure 8.2
- Wafer handling with cassettes (left) and FOUPs (right)
- Figure 8.3
- Diamondlike crystal structure of Silicon
- Figure 8.4
- Classification of airborne molecular contamination AMC
- Figure 8.5
- AMC Sources in FOUPs
- Figure 8.6
- Airborne polar and non polar molecules
- Figure 8.7
- Gas-solid interaction at a surface
- Figure 8.8
- Surface sites
- Figure 8.9
- Surface after etching
- Figure 8.10
- Crystal growth at the edge of a wafer pattern
- Figure 8.11
- Pod regenerator process cycle